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Tin Solder: The Backbone of Reliable Metal Bonding
Tin solder is a metal alloy used extensively to create strong, conductive, and durable joints between metal surfaces. Composed primarily of tin (Sn)—often combined with lead (Pb), silver (Ag), copper (Cu), or other metals—tin solder is indispensable in electronics assembly, plumbing, and metalworking due to its low melting point and excellent wettability.
What Is Tin Solder?
Tin solder serves as a fusible metal alloy, which, when melted, bonds metal workpieces together through a process called soldering. Tin-based solders are typically available in wire, bar, paste, or preform forms depending on the application.
Key properties of tin solder include:
Low melting point (typically 180–250°C)
Good thermal and electrical conductivity
Corrosion resistance
Ease of application and reworkability
Common Compositions
Tin-Lead Solder (Sn-Pb)
Traditional solder, often 60/40 or 63/37 Sn-Pb
63/37 is eutectic (melts and solidifies at 183°C with no plastic phase)
Excellent workability, but being phased out due to lead toxicity
Lead-Free Solders
Common alloys: Sn-Ag-Cu (SAC305), Sn-Cu, Sn-Bi
Used in RoHS-compliant electronics
Higher melting points (around 217–221°C)